3M 863XW Plain Back Lapping Disc, 5 in Dia, No Hole, 0.02 micron Grit, Silicon Dioxide Abrasive
3M 7000044737
$4.37
/ Order multiples of 500 DC
Out of Stock
3M Lapping Disc, Plain Back, 5 in Dia, No Hole, 0.02 micron, Silicon Dioxide Abrasive, 3 mil Polyester Film Backing, Applicable Materials: High Hardness Metals, Ceramics, Optical Substrates, Metal, Silicon Carbides, Plastic and Glass
- High yield, increased throughput
- Consistent protrusion values
- Low insertion loss and back reflection
- Available in discs sheets and rolls
- Translucent color
- Ceramic fiber optic connectors
- Has a higher mineral content than 863X, making it more aggressive for faster polishing
- Designed for use on machines that run at lower speeds and lower pressures
- For use on IPC (individual pressure control) fixtures that allow connectors to float independently and allow lower machine pressure
- Eliminates messy slurries
- Produces excellent surface finish
- Reduces overall process time
- Produces high connector yields
- Used on all polishing machines
- 50 to 90 deg F temperature
- Composition: polyester film Banking, Silica, cured adhesive