3M

3M 3305 PL Wafer De-Taping Film Tape, 25 mm W x 100 m L, 0.068 mm THK, Polyester

3M 7010321285
$46.94 / Order multiples of 40 RL
Out of Stock
  • Length: 100 m
  • Thickness: 0.068 mm
  • Type: Wafer De-Taping
  • Width: 25 mm
  • Adhesion Strength: 9.41 N/cm
  • Adhesive Material: Rubber
  • Backing Material: Silicone
  • Material: Polyester
  • Tensile Strength: 78.4 N/cm

  • A transparent polyester film tape with an aggressive rubber adhesive specifically designed for the removal of silicon wafer back grinding tape
  • Enables simple, low stress, room temperature peeling of 3M adhesives from thinned silicon wafers after glass carrier debonding
  • Transparency allows for inspection without tape removal
  • High instant adhesion to substrate
  • Good holding power