
3M 3305 PL Wafer De-Taping Film Tape, 25 mm W x 100 m L, 0.068 mm THK, Polyester
3M 7010321285
$46.94
/ Order multiples of 40 RL
Out of Stock
- Length: 100 m
- Thickness: 0.068 mm
- Type: Wafer De-Taping
- Width: 25 mm
- Adhesion Strength: 9.41 N/cm
- Adhesive Material: Rubber
- Backing Material: Silicone
- Material: Polyester
- Tensile Strength: 78.4 N/cm
- A transparent polyester film tape with an aggressive rubber adhesive specifically designed for the removal of silicon wafer back grinding tape
- Enables simple, low stress, room temperature peeling of 3M adhesives from thinned silicon wafers after glass carrier debonding
- Transparency allows for inspection without tape removal
- High instant adhesion to substrate
- Good holding power